Assembly guidelines

it is important to take precautions to minimize stress from thermal or mechanical sources caused by lead forming, lead soldering and welding or overmolding during the attachment of Halleffect sensor packages to subassemblies.
Avoiding stress during assembly will not only improve the electrical performance of the device but will also reduce the possibility of long-term reliability problems.

These guidelines provide information to minimize package stress which could compromise both the performance and reliability of Micronas products.

Download "Guidelines for the Assembly of Micronas Packages" (PDF | 0.95 MB)