TDK Corporation (TSE 6762) is set to present its latest technological advancements at embedded world 2025, scheduled from March 11 to 13 in Nuremberg, Germany. Visitors are invited to discover TDK’s extensive array of embedded solutions at booth 430 in hall 1. Experts from product marketing, R&D, and sales will be available to discuss the latest innovations.

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TDK公司（TSE:6762）进一步扩展了其InvenSense SmartAutomotive™ MEMS传感器系列，推出了用于汽车安全应用的IAM-20685HP和IAM-20689第二代6轴IMU。

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TDK Corporation (TSE: 6762) will showcase its solution portfolio for the entire spectrum of electronics applications at electronica 2024 in Munich, Germany – from November 12 to 15, 2024.

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TDK 株式会社(TSE:6762)推出面向汽车和工业应用场景的 TAS8240 传感器，扩大了其隧道磁阻(TMR)角度 传感器产品系列。这款全新传感器提供紧凑型

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TDK Corporation (TSE:6762) announces its upcoming attendance at Sensors Converge 2024, located at booth #920 at the Santa Clara Convention Center, June 25-26.

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TDK 株式会社（TSE：6762）利用其卓尔不凡的霍尔效应 3D 位置传感器产品系列的最新成员 HAL/HAR 3936*，进一步扩展了其著名的 Micronas 3D HAL^® 位置传感器系列。HAL/HAR 3936 是磁位处理技术的重大进步，旨在满足现代汽车和工业应用场景的苛刻要求。

TDK Corporation (TSE:6762) showcases its latest passive component and sensor innovations at this year’s PCIM and Sensor+Test, taking place in parallel from June 11 to 13 in the Exhibition Center Nuremberg, Germany. 

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TDK 株式会社（TSE：6762）进一步扩充 Micronas 嵌入式电机控制器系列 HVC 5x，完全集成电机控制器与 HVC-5222D 和 HVC-5422D，以驱动小型有刷（BDC）、无刷（BLDC）或步进电机。